PB33A Brush
PB33A Brush is a 107.95 mm metal-free nylon CMP pad conditioner brush for semiconductor wafer polishing.
- Head Ø
- 80–250 mm
- Head length
- 100–500 mm
PRODUCT CATEGORY
Semiconductor & Wafer Equipment Brushes
Semiconductor and wafer cleaning puts particle control and surface risk ahead of raw scrubbing force. Wafer surfaces, carriers, MLCC handling and process equipment can require soft contact, controlled materials and carefully defined brush geometry.
Browse Wafer, Carrier & Semiconductor Equipment Brushes
Compare wafer PVA and roller formats, semiconductor hand or equipment brushes, carrier-cleaning products and conductive or dust-removal components used around precision production.
150mm Carbon Fiber Wafer Equipment Disc Brush
150mm carbon fiber wafer equipment disc brush with PEEK base and quick-change coupling for static-dissipative cleaning of end.
- Head Ø
- 150 mm
- Head length
- 15 mm
Precision Wafer Brush
Low-load, uniform contact for scratch-sensitive substrates, with width, core, fill and density matched to your wafer size.
- Head Ø
- 80–250 mm
- Head length
- 100–500 mm
Semiconductor Brush
Custom semiconductor cleaning brushes with PVA sponge or fine nylon fill.
- Head Ø
- 80–250 mm
- Head length
- 100–500 mm
Semiconductor Wafer PVA Cleaning Brush Roller
Tool-matched PVA sponge roller for post-CMP wafer scrubbers. Removes slurry particles without scratching.
- Head Ø
- 80–250 mm
- Head length
- 100–500 mm
What Must the Brush Avoid Introducing?
In precision processes, a brush can fail by shedding particles, marking the surface, carrying contamination or creating uncontrolled static. Start with those risks.
Surface sensitivity
Wafer and precision substrates may require very low-contact-pressure materials or sponge-type cleaning rather than conventional bristles.
Particle and cleanliness control
Specify whether the process has cleanroom, particle-shedding or material-extractable requirements.
Wet or dry process
PVA and wet-cleaning systems behave differently from dry dust-removal or static-control brushes.
Equipment integration
Rollers, discs and plate brushes need exact OD, width, shaft or base geometry to maintain controlled contact in the machine.
Wafer-Cleaning Media and General Electronics Brushes Are Different Classes
A PVA wafer roller is selected around wet contact and surface protection, while a carbon-fiber equipment brush may address dry particles or static. Both are precision tools, but their cleaning mechanisms are not interchangeable.
Precision Equipment Brush Customization
Roller diameter, working width, sponge or filament material, core, shaft, base, contact profile and electrical properties can be tailored. Process drawings and cleanliness requirements are important inputs.
- Roller diameter
- Working width
- Sponge or filament material
- Core
- Shaft
- Base
- Contact profile
- Electrical properties
Share the Process Surface and Cleanliness Requirement
Send the substrate or equipment area, wet/dry process, contamination, cleanliness or ESD requirement and mounting dimensions. We can then assess the correct precision brush format.